Custom PCB Fabrication: HDI, Flex, Metal Core & RF Microwave Boards (Prototype to Volume)

▶ 1. FR-4 Multilayer PCB - High Density Interconnect Solution

Applications: Communication Equipment, Industrial Control Motherboards, Medical Instruments, Consumer Electronics

• High Density Design: Supports 2-32 layers, min trace width/spacing 3/3mil, HDI capabilities.
• High Frequency Optimization: Low dielectric constant materials (Dk=4.3-4.8), supporting 10GHz+ applications.
• Eco-Compliance: RoHS 2.0, REACH SVHC, Halogen-free options available.

▶ 2. Flexible PCB (FPC) - Dynamic Bending Solution

Applications: Wearable Devices, Medical Devices, Automotive Sensors, Foldable Displays

• Superior Flexibility: Bending radius <1mm, capable of >1 million dynamic flex cycles.
• Ultra-Thin & Lightweight: Thickness 0.05-0.3mm, reducing weight by 70%.
• High Density Design: Min aperture 0.1mm, trace width/spacing 2/2mil.

▶ 3. Aluminum PCB - Professional Thermal Solution

Applications: LED Lighting Systems, Automotive Headlights, Power Modules, High-Power Equipment

• Excellent Thermal Performance: Thermal conductivity 1.0-3.0 W/m·K, improving heat dissipation efficiency by 8-10 times.
• UL Certified Reliability: UL94 V-0 flame retardant certified, breakdown voltage >3000V AC.
• Lightweight Design: Density 2.7g/cm³, perfect balance between heat dissipation and weight.

▶ 4. Copper Core PCB - High Power Solution

Applications: High Power RF Modules, Motor Drives, Photovoltaic Inverters, Power Systems

• Ultimate Thermal Conductivity: Up to 400 W/m·K, suitable for kilowatt-level power applications.
• High Current Capacity: Supports 2oz-10oz heavy copper, carrying currents of 100A+.
• EMI Shielding: Natural electromagnetic interference shielding effectiveness.

▶ 5. High Frequency PCB - Signal Integrity Solution

• Low Loss Materials: PTFE/Ceramic fillers, Df value <0.002 @10GHz.
• Precise Impedance Control: ±5% accuracy, supporting 100Ω differential pairs/50Ω single-ended matching.
• Signal Integrity: Strict control of dielectric constant consistency to minimize signal attenuation.

▶ 6. Rogers PCB - High Frequency Microwave Solution

Applications: 5G Base Stations, Satellite Communications, Radar Systems, Microwave RF Modules

• Ultra-Low Loss Performance: Df as low as 0.0009 @10GHz (RT/duroid 5880).
• Stable Dielectric Constant: Dk range 2.2-10.2, thermal stability ±0.05%.
• Material Support: Full series support including RO3000®, RO4000®, RT/duroid®.
• High Frequency & Hybrid: Supports up to 110GHz mmWave; Rogers+FR-4 hybrid multilayer capability.

▶ 7. PTFE/Teflon PCB - Ultra-High Frequency Solution

Applications: Aerospace Electronics, Defense Systems, Medical Imaging, Terahertz Applications

• Industry Lowest Loss: Df value <0.001 @10GHz.
• Extreme Frequency Range: Stable performance from DC to 300GHz.
• Exceptional Durability: Operating temp -270℃ to +260℃, chemically resistant.
• Specialized Processing: Sodium naphthalene activation and plasma treatment technologies.